JPH054837B2 - - Google Patents
Info
- Publication number
- JPH054837B2 JPH054837B2 JP7564787A JP7564787A JPH054837B2 JP H054837 B2 JPH054837 B2 JP H054837B2 JP 7564787 A JP7564787 A JP 7564787A JP 7564787 A JP7564787 A JP 7564787A JP H054837 B2 JPH054837 B2 JP H054837B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- printed circuit
- cavity
- circuit board
- shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 7
- 238000002347 injection Methods 0.000 claims description 5
- 239000007924 injection Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000001746 injection moulding Methods 0.000 description 6
- 238000005530 etching Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920001342 Bakelite® Polymers 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7564787A JPS63241984A (ja) | 1987-03-27 | 1987-03-27 | プリント回路基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7564787A JPS63241984A (ja) | 1987-03-27 | 1987-03-27 | プリント回路基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63241984A JPS63241984A (ja) | 1988-10-07 |
| JPH054837B2 true JPH054837B2 (en]) | 1993-01-20 |
Family
ID=13582258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7564787A Granted JPS63241984A (ja) | 1987-03-27 | 1987-03-27 | プリント回路基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63241984A (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8109612B2 (en) | 2005-08-29 | 2012-02-07 | Fujifilm Corporation | Wiring substrate, method of manufacturing wiring substrate, and liquid droplet ejection head |
| JP2007096283A (ja) * | 2005-08-29 | 2007-04-12 | Fujifilm Corp | 配線基板とその製造方法及び液滴吐出ヘッド |
-
1987
- 1987-03-27 JP JP7564787A patent/JPS63241984A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63241984A (ja) | 1988-10-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5291179A (en) | Printed circuit board | |
| JPH02220314A (ja) | フレキシブル基板内蔵の電子部品樹脂モールドケース及びその製造方法 | |
| JPH054837B2 (en]) | ||
| JPS6146049B2 (en]) | ||
| JP3304065B2 (ja) | 電子基板の製造方法 | |
| JP2631808B2 (ja) | プリント回路基板とプリント回路基板用転写シートおよびプリント回路基板の製造方法 | |
| JPS63164294A (ja) | プリント回路基板の製造方法 | |
| JPH0814039B2 (ja) | 回路基板用樹脂成形金型を使用した基板の製造方法 | |
| JP3388428B2 (ja) | 開口部付き基板へのモールド樹脂成形方法 | |
| JP3193896B2 (ja) | 電子部品の抵抗体基板製造方法 | |
| JPH054836B2 (en]) | ||
| JPH0774451A (ja) | 回路基板の製造方法 | |
| JPH04221879A (ja) | ジャンパー部を有するプリント回路基板およびその製法 | |
| JP7466183B2 (ja) | 端子付き回路基板内蔵ケース | |
| JP2624536B2 (ja) | 複数の接続導電リードを有する電気部品の製造方法およびその製造方法に用いる製造型 | |
| JPH0483391A (ja) | モールド成形回路基板の製造方法 | |
| JP3355482B2 (ja) | 部材の導電部へのモールド樹脂による金属板接続方法 | |
| JP3294312B2 (ja) | ジャンパーチップの製造方法 | |
| JPH0851267A (ja) | 回路基板及びその製造方法 | |
| JPS6390808A (ja) | 電子部品 | |
| JP3183977B2 (ja) | 電子部品及びその製造方法 | |
| JPH0563111B2 (en]) | ||
| JPH05198943A (ja) | 回路基板の製造方法 | |
| JPH01243495A (ja) | 回路板の製造方法 | |
| JPH0821776B2 (ja) | 両面回路基板の製法 |